Thin layer deposition using atmospheric pressure plasma
The ability of plasma technologies to deposit thin layers of materials at low temperatures on any type of surface offers very interesting application prospects for industry as a whole. These thin layers can be used as interfacial layers or bonding layers, or even become ‘functional’ layers, i.e. providing functionalities such as hydrophilicity or hydrophobicity, or helping to protect surfaces.
Unlike surface activation, which leaves the chemical nature of the treated surface almost unchanged, the action of depositing a material in a thin layer on a surface totally transforms the chemical nature of the surface.
Principle of plasma assisted vapour deposition
Plasma deposition of thin layers of material is the result of a chemical sequence involving reagents in gaseous and vapour forms for the constituent atoms of the material that are not available in gaseous form. In materials science, this sequence is known as Chemical Vapour Deposition (CVD).
As with any chemical reaction, external heating to significantly raise the surface temperature is often necessary to unlock the reaction kinetics. However, by using a plasma to ionise the gases involved in the reaction, this thermal requirement is eliminated, making it possible to carry out CVD reactions without the need for external heating.
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Silica (SiO2) deposition
A multi-purpose material, silica can be deposited from several inexpensive chemical precursors at deposition rates that are perfectly compatible with industrial production requirements.
Depositing other materials
Proofs of concept have been produced for other materials.
More environmentally acceptable processing
Because plasma thin film deposition uses only very small quantities of liquid chemicals, it is more environmentally acceptable.